더 많은 제품 카테고리

신호 릴레이, 최대 2암페어

제조업체 부품 번호	재고 상태	가격	수량	Packaging	Series	ProductStatus	MountingType	CoilVoltage	ContactForm	ContactRating(Current)	SwitchingVoltage	CoilCurrent	CoilType	Features	TerminationStyle	SealRating	CoilInsulation	MustOperateVoltage	MustReleaseVoltage	OperateTime	ReleaseTime	OperatingTemperature	ContactMaterial
1-1617110-0 JMGST-12M = M28776/7-004M TE Connectivity Aerospace, Defense and Marine	2,193	-	RFQ	Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5-1617350-3 JMGST-26L=M28776/7-006L TE Connectivity Aerospace, Defense and Marine	3,263	-	RFQ	Bulk	MGS	Active	Through Hole	26.5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	8.3 mA	Non Latching	-	PC Pin	Sealed - Hermetically	-	14 VDC	1.4 VDC	4 ms	2 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
1-1617110-8 JMGST-5M = M28776/7-001M TE Connectivity Aerospace, Defense and Marine	3,735	-	RFQ	Bulk	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1-1617110-7 JMGST-5L = M28776/7-001L TE Connectivity Aerospace, Defense and Marine	2,885	-	RFQ	Bulk	Military, MIL-R-39016/7, MGST, CII	Active	Through Hole	5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	56 mA	Non Latching	-	PC Pin	Sealed - Hermetically	-	2.9 VDC	0.23 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
5-1617350-4 JMGST-18L=M28776/7-005L TE Connectivity Aerospace, Defense and Marine	3,222	-	RFQ	Bulk	MGS	Active	Through Hole	18VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	11.3 mA	Non Latching	-	PC Pin	Sealed - Hermetically	-	9.8 VDC	0.92 VDC	4 ms	2 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
JMSCT-26XPS JMSCT-26XPS = M28776/3-046P TE Connectivity Aerospace, Defense and Marine	3,672	-	RFQ	Bulk	Military, MIL-R-28776/3, MST, CII	Active	Through Hole	26.5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	9.5 mA	Non Latching	Diode	PC Pin	Sealed - Hermetically	-	14.2 VDC	1.37 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
1-1617168-6 JMSCT-5XPS = M28776/3-041P TE Connectivity Aerospace, Defense and Marine	3,539	-	RFQ	Bulk	Military, MIL-R-28776/3, MST, CII	Active	Through Hole	5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	59.3 mA	Non Latching	Diode	PC Pin	Sealed - Hermetically	-	2.8 VDC	0.22 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
1-1617032-8 HFW1201S183 = HALF SIZE RELAY TE Connectivity Aerospace, Defense and Marine	3,833	-	RFQ	Bulk	HFW, CII	Active	Through Hole	-	DPDT (2 Form C)	2 A	-	-	-	-	PC Pin	Sealed - Hermetically	-	-	-	4 ms	4 ms	-65°C ~ 125°C	-
HMB1201K01P RELAY GEN PURPOS DPDT 2A 26.5VDC TE Connectivity Aerospace, Defense and Marine	2,844	-	RFQ	Bulk	Military, MIL-R-39016/22, HMB, CII	Active	Through Hole	26.5VDC	DPDT (2 Form C)	2 A	28VDC - Nom	37.9 mA	Non Latching	-	PC Pin	Sealed - Hermetically	-	15 VDC	1.5 VDC	-	-	-65°C ~ 125°C	-
HMB1230K01P RELAY GEN PURPOS DPDT 2A 26.5VDC TE Connectivity Aerospace, Defense and Marine	2,723	-	RFQ	Bulk	Military, MIL-R-39016/22, HMB, CII	Active	Chassis Mount	26.5VDC	DPDT (2 Form C)	2 A	28VDC - Nom	37.9 mA	Non Latching	-	PC Pin	Sealed - Hermetically	-	15 VDC	1.5 VDC	-	-	-65°C ~ 125°C	-
HMB1131K01P HMB1131K01P = M39016/22-007P TE Connectivity Aerospace, Defense and Marine	3,080	-	RFQ	Bulk	HMB, CII	Active	Chassis Mount	26.5VDC	DPDT (2 Form C)	2 A	-	-	-	-	Solder Hook	Sealed - Hermetically	-	15 VDC	1.5 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
HMB1130K01P HMB1130K01P = M39016/22-004P TE Connectivity Aerospace, Defense and Marine	3,232	-	RFQ	Bulk	HMB, CII	Active	Chassis Mount	26.5VDC	DPDT (2 Form C)	2 A	-	-	-	-	Solder Hook	Sealed - Hermetically	-	15 VDC	1.5 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
HMB1230G01P HMB1230G01P = M39016/22-012P TE Connectivity Aerospace, Defense and Marine	2,922	-	RFQ	Bulk	HMB, CII	Active	Chassis Mount	12VDC	DPDT (2 Form C)	2 A	-	-	-	-	PC Pin	Sealed - Hermetically	-	7.2 VDC	0.7 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
HMB1131G01P HMB1131G01P = M39016/22-014P TE Connectivity Aerospace, Defense and Marine	2,911	-	RFQ	Bulk	HMB, CII	Active	Chassis Mount	12VDC	DPDT (2 Form C)	2 A	-	-	-	-	Solder Hook	Sealed - Hermetically	-	7.2 VDC	0.7 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
HMB1131F01P HMB1131F01P=M39016/22-021P TE Connectivity Aerospace, Defense and Marine	3,792	-	RFQ	Bulk	HMB, CII	Active	Chassis Mount	6VDC	DPDT (2 Form C)	2 A	-	-	-	-	Solder Hook	Sealed - Hermetically	-	-	-	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
1617038-3 HMB1130G01P = M39016/22-011P TE Connectivity Aerospace, Defense and Marine	2,226	-	RFQ	Bulk	Military, MIL-R-39016/22, HMB, CII	Active	Chassis Mount	12VDC	DPDT (2 Form C)	2 A	-	-	-	-	Solder Hook	Sealed - Hermetically	-	7.2 VDC	0.7 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
HMB1201G01P HMB1201G01P = M39016/22 TE Connectivity Aerospace, Defense and Marine	3,752	-	RFQ	Bulk	HMB, CII	Active	Through Hole	12VDC	DPDT (2 Form C)	2 A	-	-	-	-	PC Pin	Sealed - Hermetically	-	7.2 VDC	0.7 VDC	5 ms	5 ms	-65°C ~ 125°C	Silver (Ag), Gold (Au)
JMGST-5MW JMGST-5MW = M28776/7-007M TE Connectivity Aerospace, Defense and Marine	3,169	-	RFQ	Bulk	Military, MIL-R-28776/7, MGST, CII	Active	Through Hole	5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	56 mA	Non Latching	Diode	PC Pin	Sealed - Hermetically	-	2.9 VDC	0.23 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
JMGST-5LW JMGST-5LW=M28776/7-007L TE Connectivity Aerospace, Defense and Marine	3,591	-	RFQ	Bulk	Military, MIL-R-28776/7, MGST, CII	Active	Through Hole	5VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	56 mA	Non Latching	Diode	PC Pin	Sealed - Hermetically	-	2.9 VDC	0.23 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)
JMGST-12LW JMGST-12LW = M28776/7-010L TE Connectivity Aerospace, Defense and Marine	2,447	-	RFQ	Bulk	Military, MIL-R-28776/7, MGST, CII	Active	Through Hole	12VDC	DPDT (2 Form C)	1 A	115VAC, 28VDC - Max	17.7 mA	Non Latching	Diode	PC Pin	Sealed - Hermetically	-	7.1 VDC	0.65 VDC	4 ms	7.5 ms	-65°C ~ 125°C	Silver Palladium (AgPd), Gold (Au)