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| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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XR2T2411NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
2,554 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
XR2A-4001-NCONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div |
2,391 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-6411-NI.C. CONNECTOR SOCKET Omron Electronics Inc-EMC Div |
3,447 | - |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
XR3G-6401CONN IC SOCKET 64POS Omron Electronics Inc-EMC Div |
3,141 | - |
RFQ |
데이터시트 |
-,Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
XR2A-2001-NCONN IC DIP SOCKET 20POS GOLD Omron Electronics Inc-EMC Div |
2,925 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2A-2815CONN IC DIP SOCKET 28POS GOLD Omron Electronics Inc-EMC Div |
2,233 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-1511-NCONN SOCKET SIP 15POS GOLD Omron Electronics Inc-EMC Div |
2,389 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2E-3204CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
3,248 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2H-1611-NCONN ZIG-ZAG 16POS GOLD Omron Electronics Inc-EMC Div |
3,072 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | Zig-Zag | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-2000-HSGCONN IC SOCKET 20POS Omron Electronics Inc-EMC Div |
3,035 | - |
RFQ |
데이터시트 |
Bulk,Bulk | XR2 | Obsolete | Housing | 20 (1 x 20) | 0.100 (2.54mm) | - | - | Beryllium Copper | - | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-3200-HSGCONN IC SOCKET 32POS Omron Electronics Inc-EMC Div |
3,790 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | Housing | 32 (1 x 32) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2E-3205CONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
3,841 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | - | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2D-2401-NCONN IC DIP SOCKET 24POS GOLD Omron Electronics Inc-EMC Div |
3,839 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2D-4001-NCONN IC DIP SOCKET 40POS GOLD Omron Electronics Inc-EMC Div |
3,670 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2E-3201-NCONN SOCKET SIP 32POS GOLD Omron Electronics Inc-EMC Div |
2,832 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Obsolete | SIP | 32 (1 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C2611NCONN SOCKET SIP 26POS GOLD Omron Electronics Inc-EMC Div |
3,156 | - |
RFQ |
데이터시트 |
Bulk | XR2 | Active | SIP | 26 (1 x 26) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
XR2C-3215CONNECTORS - CONNECTOR Omron Electronics Inc-EMC Div |
2,151 | - |
RFQ |
데이터시트 |
Box | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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