IC, 트랜지스터용 소켓

사진: 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-318-41-003101

116-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,461 -

RFQ

116-87-318-41-003101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-314-31-012101

614-83-314-31-012101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,748 -

RFQ

614-83-314-31-012101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
121-83-312-41-001101

121-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,461 -

RFQ

121-83-312-41-001101

데이터시트

Bulk 121 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-320-41-001101

115-83-320-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,060 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-002101

116-87-314-41-002101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,916 -

RFQ

116-87-314-41-002101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
117-87-628-41-005101

117-87-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,402 -

RFQ

117-87-628-41-005101

데이터시트

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
122-83-312-41-001101

122-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,261 -

RFQ

122-83-312-41-001101

데이터시트

Bulk 122 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
123-83-312-41-001101

123-83-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,101 -

RFQ

123-83-312-41-001101

데이터시트

Bulk 123 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-001101

110-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
3,720 -

RFQ

110-83-322-41-001101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-322-41-001151

110-83-322-41-001151

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,296 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-422-41-001101

110-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,320 -

RFQ

110-83-422-41-001101

데이터시트

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-013101

116-87-306-41-013101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,713 -

RFQ

116-87-306-41-013101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-322-41-105101

110-87-322-41-105101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,604 -

RFQ

110-87-322-41-105101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-322-41-001101

614-87-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,882 -

RFQ

614-87-322-41-001101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-422-41-001101

614-87-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip
2,597 -

RFQ

614-87-422-41-001101

데이터시트

Bulk 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-105101

110-83-316-41-105101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,338 -

RFQ

110-83-316-41-105101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-314-41-003101

116-83-314-41-003101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,900 -

RFQ

116-83-314-41-003101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-87-314-41-036101

146-87-314-41-036101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,488 -

RFQ

146-87-314-41-036101

데이터시트

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-306-10-001101

299-83-306-10-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,737 -

RFQ

299-83-306-10-001101

데이터시트

Bulk 299 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
612-83-316-41-001101

612-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
3,817 -

RFQ

612-83-316-41-001101

데이터시트

Bulk 612 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 일일 평균 RFQ
20,000.000
20,000.000 표준 제품 단위
1800+
1800+ 전 세계 제조업체
15,000+
15,000+ 재고 창고
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