| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 110-87-312-41-005101CONN IC DIP SOCKET 12POS GOLDPreci-Dip | 3,950 | - | RFQ |   데이터시트 | Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 110-83-308-41-001101CONN IC DIP SOCKET 8POS GOLDPreci-Dip | 2,892 | - | RFQ |   데이터시트 | Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 110-87-308-41-105101CONN IC DIP SOCKET 8POS GOLDPreci-Dip | 2,610 | - | RFQ |   데이터시트 | Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 614-87-308-41-001101CONN IC DIP SOCKET 8POS GOLDPreci-Dip | 2,372 | - | RFQ |   데이터시트 | Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 114-87-210-41-117101CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 2,032 | - | RFQ |   데이터시트 | Bulk | 114 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-304-41-002101CONN IC DIP SOCKET 4POS GOLDPreci-Dip | 3,043 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-304-41-008101CONN IC DIP SOCKET 4POS GOLDPreci-Dip | 3,514 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-310-41-006101CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 2,618 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-83-610-41-006101CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 2,547 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 115-87-320-41-001101CONN IC DIP SOCKET 20POS GOLDPreci-Dip | 2,881 | - | RFQ | Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|   | 116-87-306-41-012101CONN IC DIP SOCKET 6POS GOLDPreci-Dip | 3,187 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 114-87-306-41-134191CONN IC DIP SOCKET 6POS GOLDPreci-Dip | 3,635 | - | RFQ | Tape & Reel (TR),Cut Tape (CT) | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|   | 114-87-310-41-117101CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 2,614 | - | RFQ |   데이터시트 | Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 114-87-310-41-134161CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 2,167 | - | RFQ |   데이터시트 | Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 614-83-306-41-001101CONN IC DIP SOCKET 6POS GOLDPreci-Dip | 2,458 | - | RFQ |   데이터시트 | Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 115-87-310-41-003101CONN IC DIP SOCKET 10POS GOLDPreci-Dip | 3,314 | - | RFQ |   데이터시트 | Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 110-83-306-41-105101CONN IC DIP SOCKET 6POS GOLDPreci-Dip | 3,198 | - | RFQ |   데이터시트 | Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-87-304-41-011101CONN IC DIP SOCKET 4POS GOLDPreci-Dip | 2,045 | - | RFQ |   데이터시트 | Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 116-87-308-41-006101CONN IC DIP SOCKET 8POS GOLDPreci-Dip | 2,062 | - | RFQ |   데이터시트 | Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | 
|   | 110-87-308-41-105161CONN IC DIP SOCKET 8POS GOLDPreci-Dip | 3,580 | - | RFQ |   데이터시트 | Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |