IC, 트랜지스터용 소켓

사진: 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-87-169-13-000101

510-87-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip
2,624 -

RFQ

510-87-169-13-000101

데이터시트

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-642-41-035101

146-83-642-41-035101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,090 -

RFQ

146-83-642-41-035101

데이터시트

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-642-41-036101

146-83-642-41-036101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip
2,579 -

RFQ

146-83-642-41-036101

데이터시트

Bulk 146 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
XR2A-3211-N

XR2A-3211-N

CONN IC DIP SOCKET 32POS GOLD

Omron Electronics Inc-EMC Div
2,626 -

RFQ

XR2A-3211-N

데이터시트

Bulk,Box XR2 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled
APA-320-T-A

APA-320-T-A

ADAPTER PLUG

Samtec Inc.
3,394 -

RFQ

Bulk APA Active - 20 (2 x 10) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
04-0501-20

04-0501-20

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,088 -

RFQ

04-0501-20

데이터시트

Bulk 501 Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
04-0501-30

04-0501-30

CONN SOCKET SIP 4POS TIN

Aries Electronics
3,261 -

RFQ

04-0501-30

데이터시트

Bulk 501 Active SIP 4 (1 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-10M

20-3518-10M

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,041 -

RFQ

20-3518-10M

데이터시트

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3513-10T

28-3513-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,420 -

RFQ

28-3513-10T

데이터시트

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-1518-10T

38-1518-10T

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics
3,979 -

RFQ

38-1518-10T

데이터시트

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
117-87-668-41-105101

117-87-668-41-105101

CONN IC DIP SOCKET 68POS GOLD

Preci-Dip
3,634 -

RFQ

117-87-668-41-105101

데이터시트

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 68 (2 x 34) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
29-0518-11

29-0518-11

CONN SOCKET SIP 29POS GOLD

Aries Electronics
2,234 -

RFQ

29-0518-11

데이터시트

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
39-0518-10T

39-0518-10T

CONN SOCKET SIP 39POS GOLD

Aries Electronics
2,266 -

RFQ

39-0518-10T

데이터시트

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-87-168-17-001101

510-87-168-17-001101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,631 -

RFQ

510-87-168-17-001101

데이터시트

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-168-17-101101

510-87-168-17-101101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,354 -

RFQ

510-87-168-17-101101

데이터시트

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-168-17-102101

510-87-168-17-102101

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,878 -

RFQ

510-87-168-17-102101

데이터시트

Bulk 510 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
37-0518-10T

37-0518-10T

CONN SOCKET SIP 37POS GOLD

Aries Electronics
2,328 -

RFQ

37-0518-10T

데이터시트

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-83-100-13-061101

510-83-100-13-061101

CONN SOCKET PGA 100POS GOLD

Preci-Dip
2,007 -

RFQ

510-83-100-13-061101

데이터시트

Bulk 510 Active PGA 100 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-159-16-071101

510-87-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip
3,050 -

RFQ

510-87-159-16-071101

데이터시트

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-012101

116-83-648-41-012101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,228 -

RFQ

116-83-648-41-012101

데이터시트

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1800+
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15,000+
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