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IC, 트랜지스터용 소켓
| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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123-13-320-41-001000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
3,728 | - |
RFQ |
데이터시트 |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
510-87-172-16-001101CONN SOCKET PGA 172POS GOLD Preci-Dip |
3,861 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 172 (16 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
APA-314-T-PADAPTER PLUG Samtec Inc. |
2,121 | - |
RFQ |
Tube | APA | Active | - | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
ICA-318-SGGCONN IC DIP SOCKET 18POS GOLD Samtec Inc. |
3,023 | - |
RFQ |
데이터시트 |
Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
614-43-632-31-012000CONN IC DIP SOCKET 32POS GOLD Mill-Max Manufacturing Corp. |
2,751 | - |
RFQ |
데이터시트 |
Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
116-87-648-41-007101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
2,687 | - |
RFQ |
데이터시트 |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
28-6518-11CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,182 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3518-11CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,850 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
299-43-316-10-001000CONN IC DIP SOCKET 16POS GOLD Mill-Max Manufacturing Corp. |
3,702 | - |
RFQ |
데이터시트 |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-109-12-051101CONN SOCKET PGA 109POS GOLD Preci-Dip |
2,962 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 109 (12 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
12-3513-11HCONN IC DIP SOCKET 12POS GOLD Aries Electronics |
3,702 | - |
RFQ |
데이터시트 |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
21-0518-00CONN SOCKET SIP 21POS GOLD Aries Electronics |
3,623 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-1518-11CONN IC DIP SOCKET 30POS GOLD Aries Electronics |
3,012 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
44-1518-10CONN IC DIP SOCKET 44POS GOLD Aries Electronics |
2,191 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0518-11CONN SOCKET SIP 30POS GOLD Aries Electronics |
3,919 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
37-0518-10HCONN SOCKET SIP 37POS GOLD Aries Electronics |
3,023 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | SIP | 37 (1 x 37) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-174-17-061101CONN SOCKET PGA 174POS GOLD Preci-Dip |
3,356 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 174 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-174-17-081101CONN SOCKET PGA 174POS GOLD Preci-Dip |
3,713 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 174 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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|
346-93-128-41-013000CONN SOCKET SIP 28POS GOLD Mill-Max Manufacturing Corp. |
2,497 | - |
RFQ |
데이터시트 |
Bulk | 346 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-128-41-013000CONN SOCKET SIP 28POS GOLD Mill-Max Manufacturing Corp. |
3,345 | - |
RFQ |
데이터시트 |
Bulk | 346 | Active | SIP | 28 (1 x 28) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
- 1500+ 일일 평균 RFQ
- 20,000.000 표준 제품 단위
- 1800+ 전 세계 제조업체
- 15,000+ 재고 창고
