| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 211-1-06-003CONN IC DIP SOCKET 6POS GOLDCNC Tech | 8,006 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | 211-1-08-003CONN IC DIP SOCKET 8POS GOLDCNC Tech | 5,796 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | DILB24P-224TLFCONN IC DIP SOCKET 24POS TINLEADAmphenol ICC (FCI) | 10,853 | - | RFQ |   데이터시트 | Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | 
|   | 211-1-14-003CONN IC DIP SOCKET 14POS GOLDCNC Tech | 2,554 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | D01-9970742CONN SOCKET SIP 7POS GOLDHarwin Inc. | 4,797 | - | RFQ |   데이터시트 | Tube | D01-997 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 
|   | D01-9971242CONN SOCKET SIP 12POS GOLDHarwin Inc. | 4,700 | - | RFQ |   데이터시트 | Tube | D01-997 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled | 
|   | 211-1-16-003CONN IC DIP SOCKET 16POS GOLDCNC Tech | 2,759 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | 211-1-18-003CONN IC DIP SOCKET 18POS GOLDCNC Tech | 2,790 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | ICA-308-STTCONN IC DIP SOCKET 8POS TINSamtec Inc. | 3,040 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | 211-1-20-003CONN IC DIP SOCKET 20POS GOLDCNC Tech | 1,281 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | 1050281001CONN CAM SOCKET 32POS GOLDMolex | 21,667 | - | RFQ |   데이터시트 | Tape & Reel (TR),Cut Tape (CT) | 105028 | Active | Camera Socket | 32 (4 x 8) | 0.035 (0.90mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.035 (0.90mm) | Nickel | 50.0µin (1.27µm) | Copper Alloy | Thermoplastic | 
|   | 211-1-24-006CONN IC DIP SOCKET 24POS GOLDCNC Tech | 1,307 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | 211-1-28-006CONN IC DIP SOCKET 28POS GOLDCNC Tech | 1,315 | - | RFQ |   데이터시트 | Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | 
|   | NTE435K64SOCKET-64 PIN DIP .070NTE Electronics, Inc | 296 | - | RFQ |   데이터시트 | Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 64 (2 x 32) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - | 
|   | ICA-318-STTCONN IC DIP SOCKET 18POS TINSamtec Inc. | 1,054 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | NTE419SOCKET-3-PIN TO-5NTE Electronics, Inc | 600 | - | RFQ |   데이터시트 | Bulk | - | Active | Transistor, TO-5 and TO-39 | 3 (Round) | - | - | - | - | Through Hole | - | Solder | - | - | - | - | - | 
|   | NTE209SOCKET TO-3 PWRNTE Electronics, Inc | 267 | - | RFQ |   데이터시트 | Bulk | - | Active | Transistor, TO-3 | 2 (1 x 2) | - | - | - | - | Through Hole | - | - | - | - | - | - | - | 
|   | NTE435K52SOCKET-52 PIN DIP .070NTE Electronics, Inc | 1,116 | - | RFQ |   데이터시트 | Bulk | - | Active | DIP, 0.698 (17.72mm) Row Spacing | 52 (2 x 26) | - | - | - | - | Through Hole | - | Solder | 0.070 (1.78mm) | - | - | - | - | 
|   | ICF-328-T-O-TR.100 SURFACE MOUNT SCREW MACHINSamtec Inc. | 350 | - | RFQ | Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | |
|   | NTE436W2828-PIN DIP IC SOCKETNTE Electronics, Inc | 296 | - | RFQ |   데이터시트 | Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |