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IC, 트랜지스터용 소켓

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
09-7970-11 CONN SOCKET SIP 9POS GOLD Aries Electronics	3,261	-	RFQ	데이터시트	Bulk	700 Elevator Strip-Line™	Active	SIP	9 (1 x 9)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Elevated	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
24-0508-20 CONN SOCKET SIP 24POS GOLD Aries Electronics	3,174	-	RFQ	데이터시트	Bulk	508	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-0508-30 CONN SOCKET SIP 24POS GOLD Aries Electronics	2,086	-	RFQ	데이터시트	Bulk	508	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-1508-20 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,910	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
24-1508-30 CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,289	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
40-6501-30 CONN IC DIP SOCKET 40POS TIN Aries Electronics	2,718	-	RFQ		Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
14-0503-21 CONN SOCKET SIP 14POS GOLD Aries Electronics	2,722	-	RFQ	데이터시트	Bulk	0503	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled
14-0503-31 CONN SOCKET SIP 14POS GOLD Aries Electronics	3,455	-	RFQ	데이터시트	Bulk	0503	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA), Nylon, Glass Filled
16-6501-21 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3,108	-	RFQ	데이터시트	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
16-6501-31 CONN IC DIP SOCKET 16POS GOLD Aries Electronics	3,175	-	RFQ	데이터시트	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	16 (2 x 8)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
40-6501-20 CONN IC DIP SOCKET 40POS TIN Aries Electronics	2,550	-	RFQ	데이터시트	Bulk	501	Active	DIP, 0.6 (15.24mm) Row Spacing	40 (2 x 20)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
346-93-163-41-013000 CONN SOCKET SIP 63POS GOLD Mill-Max Manufacturing Corp.	3,226	-	RFQ	데이터시트	Bulk	346	Active	SIP	63 (1 x 63)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
346-43-163-41-013000 CONN SOCKET SIP 63POS GOLD Mill-Max Manufacturing Corp.	2,482	-	RFQ	데이터시트	Bulk	346	Active	SIP	63 (1 x 63)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	-	Press-Fit	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
08-3508-21 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2,729	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
08-3508-31 CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2,200	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.3 (7.62mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Open Frame	Wire Wrap	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
110-99-310-41-001000 CONN IC DIP SOCKET 10POS TINLEAD Mill-Max Manufacturing Corp.	2,811	-	RFQ	데이터시트	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin-Lead	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-310-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,458	-	RFQ	데이터시트	Tube	110	Active	DIP, 0.3 (7.62mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Tin	100.0µin (2.54µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass Alloy	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-304-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	2,857	-	RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
110-91-304-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.	3,909	-	RFQ		Tube	*	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-
20-822-90TWR CONN IC DIP SOCKET 20POS TIN Aries Electronics	2,975	-	RFQ	데이터시트	Bulk	Vertisockets™ 800	Active	DIP, 0.3 (7.62mm) Row Spacing	20 (2 x 10)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole, Right Angle, Horizontal	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6