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IC, 트랜지스터용 소켓

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
06-0508-20 CONN SOCKET SIP 6POS GOLD Aries Electronics	3,719	-	RFQ	데이터시트	Bulk	508	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
06-0508-30 CONN SOCKET SIP 6POS GOLD Aries Electronics	2,827	-	RFQ	데이터시트	Bulk	508	Active	SIP	6 (1 x 6)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
06-1508-20 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	2,981	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
06-1508-30 CONN IC DIP SOCKET 6POS GOLD Aries Electronics	2,423	-	RFQ	데이터시트	Bulk	508	Active	DIP, 0.2 (5.08mm) Row Spacing	6 (2 x 3)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Wire Wrap	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
23-0518-10T CONN SOCKET SIP 23POS GOLD Aries Electronics	3,730	-	RFQ	데이터시트	Bulk	518	Active	SIP	23 (1 x 23)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
13-0513-10H CONN SOCKET SIP 13POS GOLD Aries Electronics	3,753	-	RFQ	데이터시트	Bulk	0513	Active	SIP	13 (1 x 13)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
18-0513-10 CONN SOCKET SIP 18POS GOLD Aries Electronics	2,380	-	RFQ	데이터시트	Bulk	0513	Active	SIP	18 (1 x 18)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-0518-00 CONN SOCKET SIP 14POS GOLD Aries Electronics	2,054	-	RFQ	데이터시트	Bulk	518	Active	SIP	14 (1 x 14)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Surface Mount	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
14-1518-00 CONN IC DIP SOCKET 14POS GOLD Aries Electronics	2,354	-	RFQ	데이터시트	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	14 (2 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
19-0518-11 CONN SOCKET SIP 19POS GOLD Aries Electronics	3,606	-	RFQ	데이터시트	Bulk	518	Active	SIP	19 (1 x 19)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
28-0518-10 CONN SOCKET SIP 28POS GOLD Aries Electronics	2,971	-	RFQ	데이터시트	Bulk	518	Active	SIP	28 (1 x 28)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-0518-10H CONN SOCKET SIP 24POS GOLD Aries Electronics	3,259	-	RFQ	데이터시트	Bulk	518	Active	SIP	24 (1 x 24)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
24-1518-10H CONN IC DIP SOCKET 24POS GOLD Aries Electronics	2,191	-	RFQ	데이터시트	Bulk	518	Active	DIP, 0.2 (5.08mm) Row Spacing	24 (2 x 12)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
18-3511-10 CONN IC DIP SOCKET 18POS TIN Aries Electronics	3,498	-	RFQ	데이터시트	Bulk	511	Active	DIP, 0.3 (7.62mm) Row Spacing	18 (2 x 9)	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
08-2513-11H CONN IC DIP SOCKET 8POS GOLD Aries Electronics	2,204	-	RFQ	데이터시트	Bulk	Lo-PRO®file, 513	Active	DIP, 0.2 (5.08mm) Row Spacing	8 (2 x 4)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10 CONN SOCKET SIP 29POS GOLD Aries Electronics	2,523	-	RFQ	데이터시트	Bulk	518	Active	SIP	29 (1 x 29)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Open Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
07-0508-20 CONN SOCKET SIP 7POS GOLD Aries Electronics	2,002	-	RFQ	데이터시트	Bulk	508	Active	SIP	7 (1 x 7)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Wire Wrap	-	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6
04-0511-10 CONN SOCKET SIP 4POS TIN Aries Electronics	3,494	-	RFQ	데이터시트	Bulk	511	Active	SIP	4 (1 x 4)	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Through Hole	-	Solder	0.100 (2.54mm)	Tin	50.0µin (1.27µm)	Phosphor Bronze	Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-11 CONN IC DIP SOCKET 10POS GOLD Aries Electronics	2,300	-	RFQ	데이터시트	Bulk	Lo-PRO®file, 513	Active	DIP, 0.6 (15.24mm) Row Spacing	10 (2 x 5)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled
20-0513-10T CONN SOCKET SIP 20POS GOLD Aries Electronics	3,032	-	RFQ	데이터시트	Bulk	0513	Active	SIP	20 (1 x 20)	0.100 (2.54mm)	Gold	10.0µin (0.25µm)	Beryllium Copper	Through Hole	-	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Brass	Polyamide (PA46), Nylon 4/6, Glass Filled