| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | ICF-632-S-O-TRCONN IC DIP SOCKET 32POS TINSamtec Inc. | 273 | - | RFQ |   데이터시트 | Tape & Reel (TR),Cut Tape (CT) | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | 
|   | ICA-308-SGGCONN IC DIP SOCKET 8POS GOLDSamtec Inc. | 568 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | 
|   | ICF-640-S-OCONN IC DIP SOCKET 40POS TINSamtec Inc. | 794 | - | RFQ |   데이터시트 | Tube | iCF | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | 
|  | ICF-308-T-OCONN IC DIP SOCKET 8POS TINSamtec Inc. | 3,892 | - | RFQ |   데이터시트 | Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | 
|   | ICA-308-SSTCONN IC DIP SOCKET 8POS GOLDSamtec Inc. | 961 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | ICA-320-STTCONN IC DIP SKT 20POSSamtec Inc. | 142 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|  | ICA-308-SGTCONN IC DIP SOCKET 8POS GOLDSamtec Inc. | 2,488 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | 
|  | ICA-314-SSTCONN IC DIP SOCKET 14POS GOLDSamtec Inc. | 989 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | 
|  | ICA-628-STTCONN IC DIP SOCKET 28POS TINSamtec Inc. | 3,577 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|  | ICA-314-SGTCONN IC DIP SOCKET 14POS GOLDSamtec Inc. | 3,880 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Brass | Polyester, Glass Filled | 
|  | ICF-308-S-OCONN IC DIP SOCKET 8POS TINSamtec Inc. | 3,649 | - | RFQ |   데이터시트 | Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | 
|   | ICO-316-SGTCONN IC DIP SOCKET 16POS GOLDSamtec Inc. | 2,560 | - | RFQ |   데이터시트 | Tube | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | ICA-316-SGTCONN IC DIP SKT 16POSSamtec Inc. | 2,101 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | ICA-640-STTCONN IC DIP SOCKET 40POS TINSamtec Inc. | 3,057 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | APO-308-G-HCONN DIP ADAPT 8POSSamtec Inc. | 3,631 | - | RFQ | Bulk | APO | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|   | ICO-640-SGTCONN IC DIP SOCKET 40POS GOLDSamtec Inc. | 2,338 | - | RFQ |   데이터시트 | Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled | 
|   | ICA-314-SGGCONN IC DIP SOCKET 14POS GOLDSamtec Inc. | 2,892 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | 
|   | ICF-318-T-OCONN IC DIP SOCKET 18POS TINSamtec Inc. | 2,551 | - | RFQ |   데이터시트 | Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | 
|   | ICA-628-SGGCONN IC DIP SOCKET 28POS GOLDSamtec Inc. | 2,577 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled | 
|   | ICA-640-SGGCONN IC DIP SOCKET 40POS GOLDSamtec Inc. | 2,785 | - | RFQ |   데이터시트 | Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |