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| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-13-159-16-105002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,140 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 159 (16 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-159-16-105003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,439 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 159 (16 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
558-10-360M19-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,777 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | PGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
32-6556-40CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
3,567 | - |
RFQ |
데이터시트 |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
510-13-161-15-005001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,503 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 161 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-161-15-005002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,816 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 161 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-161-15-005003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,569 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 161 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
514-83-388M26-001148CONN SOCKET BGA 388POS GOLD Preci-Dip |
3,399 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 388 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-93-299-20-096001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,286 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-299-20-096002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,234 | - |
RFQ |
데이터시트 |
Tube | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-299-20-096003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,313 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
192-PGM17025-11CONN SOCKET PGA GOLD Aries Electronics |
2,862 | - |
RFQ |
데이터시트 |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-91-361-19-000002SOCKET SOLDERTAIL 361-PGA Mill-Max Manufacturing Corp. |
2,370 | - |
RFQ |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-361-19-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,265 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-361-19-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,215 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-43-281-19-081002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,280 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
546-87-528-21-121147CONN SOCKET PGA 528POS GOLD Preci-Dip |
3,755 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 528 (21 x 21) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-388M26-001152BGA SOLDER TAIL Preci-Dip |
3,935 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
6-1437522-9STAMPED PIN TE Connectivity AMP Connectors |
2,408 | - |
RFQ |
Bulk,Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
84-PGM13042-10TCONN SOCKET PGA TIN Aries Electronics |
2,236 | - |
RFQ |
데이터시트 |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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