| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | Composition | Diameter | MeltingPoint | FluxType | WireGauge | MeshType | Process | Form | ShelfLife | ShelfLifeStart | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | SMDSWLF.006 10GSOLDER WIRE SN96.5/AG3/CU0.5Chip Quik Inc. | 2,262 | - | RFQ |   데이터시트 | Bulk | - | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006 (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - | 
|  | RASW.020 1LBSOLDER WIRE 63/37 TIN/LEAD ROSINChip Quik Inc. | 3,667 | - | RFQ |   데이터시트 | Bulk | - | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020 (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 
|   | SMD2SWLF.012 100GLF SOLDER WIRE 99.3/0.7 TIN/COPPChip Quik Inc. | 2,745 | - | RFQ |   데이터시트 | Bulk | SMD2 | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012 (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | 
|   | BARSN99.3CU0.7SOLDER BAR SN99.3/CU0.7 1LB SUPEChip Quik Inc. | 2,722 | - | RFQ |   데이터시트 | Bulk | Super Low Dross™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | 
|   | WBARS99.3/.7SN99.3/CU.7 1 LB. BARSRA Soldering Products | 3,547 | - | RFQ |   데이터시트 | Bag | SUPER-PURE™ | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | - | - | - | - | Lead Free | Bar, 1 lb (453.59g) | - | - | 
|   | SMD291AX250T4SLDR PST NO-CLEAN 63/37 T4 250GChip Quik Inc. | 3,165 | - | RFQ |   데이터시트 | Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 
|   | SMD4300AX250T4SLDR PST WATR SOL 63/37 T4 250GChip Quik Inc. | 2,161 | - | RFQ |   데이터시트 | Jar | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 
|   | T0051388799WSW SAC L0 SN3,0AG0,5CU3,5%Apex Tool Group | 3,854 | - | RFQ |   데이터시트 | Spool | Weller® | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031 (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 8.8 oz (250g) | - | - | 
|   | 4865-454GSOLDER NO-CLEAN 63/37 1 LBMG Chemicals | 2,314 | - | RFQ |   데이터시트 | Spool | 4860 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | 4875-454GSOLDER NO-CLEAN 60/40 1 LBMG Chemicals | 3,061 | - | RFQ |   데이터시트 | Spool | 4870 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032 (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | 4885-454GSOLDER RA 63/37 .032 1 LBSMG Chemicals | 3,328 | - | RFQ |   데이터시트 | Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032 (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | 4895-454GSOLDER RA 60/40 .032 1 LBMG Chemicals | 3,282 | - | RFQ |   데이터시트 | Spool | 4890 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032 (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | 4894-454GSOLDER RA 60/40 .025 1 LBMG Chemicals | 2,886 | - | RFQ |   데이터시트 | Spool | 4890 | Active | Wire Solder | Sn60Pb40 (60/40) | 0.025 (0.64mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | 4884-454GSOLDER RA 63/37 .025 1 LBSMG Chemicals | 2,717 | - | RFQ |   데이터시트 | Spool | 4880 | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025 (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | 
|   | SMD291SNL250T4SLDR PST NO-CLEAN SAC305 T4 250GChip Quik Inc. | 2,009 | - | RFQ |   데이터시트 | Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 
|   | SMD4300SNL250T4SLDR PST WATR SOL SAC305 T4 250GChip Quik Inc. | 2,526 | - | RFQ |   데이터시트 | Jar | - | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | Water Soluble | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 
|   | TS391AXTHERMALLY STABLE SOLDER PASTE NOChip Quik Inc. | 2,887 | - | RFQ |   데이터시트 | Bulk | - | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 
|   | TS391LTTHERMALLY STABLE SOLDER PASTE NOChip Quik Inc. | 3,165 | - | RFQ |   데이터시트 | Bulk | - | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 
|   | SMDSWLF.008 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SIChip Quik Inc. | 2,723 | - | RFQ |   데이터시트 | Bulk | SMD | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008 (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 32 AWG, 35 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - | 
|   | SMDSWLT.040 50GSN42/BI57/AG1 2.2 FLUX CORE SOLDChip Quik Inc. | 3,735 | - | RFQ |   데이터시트 | Bulk | SMD | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040 (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 1.8 oz (50g) | - | - |