IC, 트랜지스터용 소켓

사진: 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-308-41-009101

116-87-308-41-009101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,641 -

RFQ

116-87-308-41-009101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-310-41-001101

614-83-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,117 -

RFQ

614-83-310-41-001101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-210-41-006101

116-83-210-41-006101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,207 -

RFQ

116-83-210-41-006101

데이터시트

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-312-41-018101

116-87-312-41-018101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,683 -

RFQ

116-87-312-41-018101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-210-41-105101

110-83-210-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,793 -

RFQ

110-83-210-41-105101

데이터시트

Bulk 110 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-012101

116-87-310-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,919 -

RFQ

116-87-310-41-012101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-610-41-012101

116-87-610-41-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,217 -

RFQ

116-87-610-41-012101

데이터시트

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-314-41-001101

110-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,979 -

RFQ

110-83-314-41-001101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-314-41-105101

110-87-314-41-105101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
2,916 -

RFQ

110-87-314-41-105101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-314-41-001101

614-87-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,644 -

RFQ

614-87-314-41-001101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-312-41-117101

114-83-312-41-117101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,472 -

RFQ

114-83-312-41-117101

데이터시트

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-83-312-41-134161

114-83-312-41-134161

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
2,426 -

RFQ

114-83-312-41-134161

데이터시트

Bulk 114 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-306-41-001101

116-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,715 -

RFQ

116-83-306-41-001101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-304-41-013101

116-87-304-41-013101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip
3,298 -

RFQ

116-87-304-41-013101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-610-41-001101

614-83-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,345 -

RFQ

614-83-610-41-001101

데이터시트

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-87-318-41-003101

115-87-318-41-003101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip
2,832 -

RFQ

115-87-318-41-003101

데이터시트

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-306-41-004101

116-87-306-41-004101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
2,230 -

RFQ

116-87-306-41-004101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-310-41-105101

110-83-310-41-105101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,789 -

RFQ

110-83-310-41-105101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-312-31-012101

614-87-312-31-012101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip
3,254 -

RFQ

614-87-312-31-012101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-007101

116-87-310-41-007101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,905 -

RFQ

116-87-310-41-007101

데이터시트

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 일일 평균 RFQ
20,000.000
20,000.000 표준 제품 단위
1800+
1800+ 전 세계 제조업체
15,000+
15,000+ 재고 창고
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