IC, 트랜지스터용 소켓

사진: 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
117-87-620-41-005101

117-87-620-41-005101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip
3,510 -

RFQ

117-87-620-41-005101

데이터시트

Bulk 117 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.070 (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
540-88-044-17-400

540-88-044-17-400

CONN SOCKET PLCC 44POS TIN

Preci-Dip
3,241 -

RFQ

540-88-044-17-400

데이터시트

Bulk 540 Active PLCC 44 (4 x 11) 0.050 (1.27mm) Tin - Phosphor Bronze Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polyphenylene Sulfide (PPS)
146-83-308-41-035101

146-83-308-41-035101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,536 -

RFQ

146-83-308-41-035101

데이터시트

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
146-83-308-41-036101

146-83-308-41-036101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,524 -

RFQ

146-83-308-41-036101

데이터시트

Bulk 146 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
115-83-314-41-001101

115-83-314-41-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,012 -

RFQ

Bulk 115 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-306-41-105191

110-87-306-41-105191

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip
3,487 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-316-41-001101

110-83-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,400 -

RFQ

110-83-316-41-001101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-605101

110-87-324-41-605101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,538 -

RFQ

110-87-324-41-605101

데이터시트

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-324-41-005101

110-87-324-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
2,488 -

RFQ

110-87-324-41-005101

데이터시트

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-87-424-41-005101

110-87-424-41-005101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,830 -

RFQ

110-87-424-41-005101

데이터시트

Bulk 110 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-314-41-018101

116-87-314-41-018101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip
3,684 -

RFQ

116-87-314-41-018101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-316-41-001101

614-87-316-41-001101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip
2,930 -

RFQ

614-87-316-41-001101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-308-41-002101

116-83-308-41-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
3,599 -

RFQ

116-83-308-41-002101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-610-31-012101

614-83-610-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,513 -

RFQ

614-83-610-31-012101

데이터시트

Bulk 614 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-002101

116-87-210-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,890 -

RFQ

116-87-210-41-002101

데이터시트

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-310-41-002101

116-87-310-41-002101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,909 -

RFQ

116-87-310-41-002101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-83-308-41-105191

110-83-308-41-105191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip
2,657 -

RFQ

Bulk 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-310-31-012101

614-83-310-31-012101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
3,653 -

RFQ

614-83-310-31-012101

데이터시트

Bulk 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-210-41-003101

116-87-210-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,295 -

RFQ

116-87-210-41-003101

데이터시트

Bulk 116 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-310-41-003101

116-83-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip
2,799 -

RFQ

116-83-310-41-003101

데이터시트

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ 일일 평균 RFQ
20,000.000
20,000.000 표준 제품 단위
1800+
1800+ 전 세계 제조업체
15,000+
15,000+ 재고 창고
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