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IC, 트랜지스터용 소켓
| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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16-0517-90CCONN SOCKET SIP 16POS GOLD Aries Electronics |
3,790 | - |
RFQ |
데이터시트 |
Bulk | 0517 | Active | SIP | 16 (1 x 16) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-232-17-061101CONN SOCKET PGA 232POS GOLD Preci-Dip |
3,174 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 232 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
13-0511-10CONN SOCKET SIP 13POS TIN Aries Electronics |
2,499 | - |
RFQ |
데이터시트 |
Bulk | 511 | Active | SIP | 13 (1 x 13) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-3518-10ECONN IC DIP SOCKET 16POS GOLD Aries Electronics |
2,974 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
514-87-078-13-061117CONN SOCKET PGA 78POS GOLD Preci-Dip |
3,374 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | PGA | 78 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
APA-422-T-MADAPTER PLUG Samtec Inc. |
3,946 | - |
RFQ |
Bulk | APA | Active | - | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
510-87-233-18-071101CONN SOCKET PGA 233POS GOLD Preci-Dip |
3,609 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 233 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
10-6511-11CONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,207 | - |
RFQ |
데이터시트 |
Bulk | 511 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-47-304-41-006000STANDRD SOLDRTL DBL SKT Mill-Max Manufacturing Corp. |
2,209 | - |
RFQ |
데이터시트 |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
16-822-90E16 PIN RT ANGLE HORIZONTAL SOCKT Aries Electronics |
2,424 | - |
RFQ |
- | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | |
|
123-43-320-41-801000CONN IC DIP SOCKET 20POS GOLD Mill-Max Manufacturing Corp. |
3,879 | - |
RFQ |
데이터시트 |
Tube | 123 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
346-93-138-41-013000CONN SOCKET SIP 38POS GOLD Mill-Max Manufacturing Corp. |
3,494 | - |
RFQ |
데이터시트 |
Bulk | 346 | Active | SIP | 38 (1 x 38) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-41-304-41-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,196 | - |
RFQ |
데이터시트 |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-91-304-41-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,497 | - |
RFQ |
데이터시트 |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
32-9513-10CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
3,897 | - |
RFQ |
데이터시트 |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-4518-10HCONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,996 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-0508-20CONN SOCKET SIP 15POS GOLD Aries Electronics |
2,287 | - |
RFQ |
데이터시트 |
Bulk | 508 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
15-0508-30CONN SOCKET SIP 15POS GOLD Aries Electronics |
3,447 | - |
RFQ |
데이터시트 |
Bulk | 508 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
510-87-236-17-061101CONN SOCKET PGA 236POS GOLD Preci-Dip |
2,377 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 236 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-236-17-062101CONN SOCKET PGA 236POS GOLD Preci-Dip |
3,541 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 236 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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