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IC, 트랜지스터용 소켓
| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APA-422-T-NADAPTER PLUG Samtec Inc. |
2,575 | - |
RFQ |
Tube | APA | Active | - | 22 (2 x 11) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
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|
32-C212-10CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,252 | - |
RFQ |
데이터시트 |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
14-0511-10CONN SOCKET SIP 14POS TIN Aries Electronics |
3,536 | - |
RFQ |
데이터시트 |
Bulk | 511 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-820-90CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,925 | - |
RFQ |
데이터시트 |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-822-90CCONN IC DIP SOCKET 10POS GOLD Aries Electronics |
2,015 | - |
RFQ |
데이터시트 |
Bulk | Vertisockets™ 800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-237-17-061101CONN SOCKET PGA 237POS GOLD Preci-Dip |
3,302 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 237 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
714-43-126-31-018000CONN SOCKET SIP 26POS GOLD Mill-Max Manufacturing Corp. |
2,464 | - |
RFQ |
데이터시트 |
Bulk | 714 | Active | SIP | 26 (1 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
08-0503-21CONN SOCKET SIP 8POS GOLD Aries Electronics |
2,416 | - |
RFQ |
데이터시트 |
Bulk | 0503 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
08-0503-31CONN SOCKET SIP 8POS GOLD Aries Electronics |
2,687 | - |
RFQ |
데이터시트 |
Bulk | 0503 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
116-83-652-41-001101CONN IC DIP SOCKET 52POS GOLD Preci-Dip |
2,186 | - |
RFQ |
데이터시트 |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
ICO-640-SSTCONN IC DIP SOCKET 40POS GOLD Samtec Inc. |
2,871 | - |
RFQ |
데이터시트 |
Tube | ICO | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
20-3501-20CONN IC DIP SOCKET 20POS TIN Aries Electronics |
3,796 | - |
RFQ |
데이터시트 |
Bulk | 501 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
20-3501-30CONN IC DIP SOCKET 20POS TIN Aries Electronics |
2,366 | - |
RFQ |
데이터시트 |
Bulk | 501 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-3518-112CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,444 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0501-20CONN SOCKET SIP 7POS TIN Aries Electronics |
3,119 | - |
RFQ |
데이터시트 |
Bulk | 501 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
07-0501-30CONN SOCKET SIP 7POS TIN Aries Electronics |
2,266 | - |
RFQ |
데이터시트 |
Bulk | 501 | Active | SIP | 7 (1 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
126-41-304-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,974 | - |
RFQ |
데이터시트 |
Tube | 126 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-91-304-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,071 | - |
RFQ |
데이터시트 |
Tube | 126 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-83-142-15-081101CONN SOCKET PGA 142POS GOLD Preci-Dip |
3,431 | - |
RFQ |
데이터시트 |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
38-3513-10CONN IC DIP SOCKET 38POS GOLD Aries Electronics |
3,942 | - |
RFQ |
데이터시트 |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 38 (2 x 19) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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