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IC, 트랜지스터용 소켓

제조업체 부품 번호	재고 상태	가격	수량	데이터시트	Packaging	Series	ProductStatus	Type	NumberofPositionsorPins(Grid)	Pitch-Mating	ContactFinish-Mating	ContactFinishThickness-Mating	ContactMaterial-Mating	MountingType	Features	Termination	Pitch-Post	ContactFinish-Post	ContactFinishThickness-Post	ContactMaterial-Post	HousingMaterial
84-PRS10003-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,437	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS11032-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,727	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS12022-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,325	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13053-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,445	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
84-PRS13125-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,250	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
18-PRS17041-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,532	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS15057-12 ZIF PGA SOCKET 56PIN 15X15 Aries Electronics	3,488	-	RFQ		-	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,845	-	RFQ	데이터시트	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PLS15057-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,763	-	RFQ	데이터시트	Bulk	PLS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
56-PRS14031-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,278	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
44-6552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,103	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3554-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,682	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,098	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3551-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,446	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3552-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,933	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-3553-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,330	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6551-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	3,848	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
44-6554-16 CONN IC DIP SOCKET ZIF 44POS Aries Electronics	2,252	-	RFQ	데이터시트	Bulk	55	Active	DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing	44 (2 x 22)	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Nickel Boron	50.0µin (1.27µm)	Beryllium Copper	Polyphenylene Sulfide (PPS), Glass Filled
85-PRS11008-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	3,718	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)
101-PRS13022-12 CONN SOCKET PGA ZIF GOLD Aries Electronics	2,001	-	RFQ	데이터시트	Bulk	PRS	Active	PGA, ZIF (ZIP)	-	0.100 (2.54mm)	Gold	30.0µin (0.76µm)	Beryllium Copper	Through Hole	Closed Frame	Solder	0.100 (2.54mm)	Tin	200.0µin (5.08µm)	Beryllium Copper	Polyphenylene Sulfide (PPS)