IC, 트랜지스터용 소켓

사진: 제조업체 부품 번호 재고 상태 가격 수량 데이터시트 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
101-PRS13023-12

101-PRS13023-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,513 -

RFQ

101-PRS13023-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16017-12

30-PLS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,563 -

RFQ

30-PLS16017-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16018-12

30-PLS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,275 -

RFQ

30-PLS16018-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16020-12

30-PLS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,684 -

RFQ

30-PLS16020-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PLS16022-12

30-PLS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,597 -

RFQ

30-PLS16022-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16017-12

30-PRS16017-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,934 -

RFQ

30-PRS16017-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16018-12

30-PRS16018-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,877 -

RFQ

30-PRS16018-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16020-12

30-PRS16020-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,583 -

RFQ

30-PRS16020-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
30-PRS16022-12

30-PRS16022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,286 -

RFQ

30-PRS16022-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12005-12

108-PLS12005-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,680 -

RFQ

108-PLS12005-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PLS12024-12

108-PLS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,541 -

RFQ

108-PLS12024-12

데이터시트

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS12024-12

108-PRS12024-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,664 -

RFQ

108-PRS12024-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
108-PRS13129-12

108-PRS13129-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics
2,697 -

RFQ

108-PRS13129-12

데이터시트

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
48-3551-16

48-3551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
3,495 -

RFQ

48-3551-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3552-16

48-3552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
3,383 -

RFQ

48-3552-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3553-16

48-3553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
2,432 -

RFQ

48-3553-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6551-16

48-6551-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
2,009 -

RFQ

48-6551-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6552-16

48-6552-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
2,751 -

RFQ

48-6552-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-6553-16

48-6553-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
3,728 -

RFQ

48-6553-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
48-3554-16

48-3554-16

CONN IC DIP SOCKET ZIF 48POS

Aries Electronics
2,387 -

RFQ

48-3554-16

데이터시트

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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1500+
1500+ 일일 평균 RFQ
20,000.000
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1800+
1800+ 전 세계 제조업체
15,000+
15,000+ 재고 창고
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