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| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
558-10-292M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,017 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | BGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-87-447-20-121147CONN SOCKET PGA 447POS GOLD Preci-Dip |
3,490 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 447 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-292M20-001105CONN SOCKET PGA 292POS GOLD Preci-Dip |
2,586 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
546-83-364-17-091147CONN SOCKET PGA 364POS GOLD Preci-Dip |
3,301 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 364 (17 x 17) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-365-14-000147CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,577 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 365 (14 x 14) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-365-17-091147CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,216 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 365 (17 x 17) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-420M26-001148CONN SOCKET BGA 420POS GOLD Preci-Dip |
3,435 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 420 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-478M26-131166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,410 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-480M29-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,829 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-83-599-54-131111CONN SOCKET PGA 599POS GOLD Preci-Dip |
2,914 | - |
RFQ |
데이터시트 |
Bulk | 517 | Active | PGA | 599 (54 x 54) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-292M20-001106CONN SOCKET PGA 292POS GOLD Preci-Dip |
2,491 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
614-83-279-19-081112CONN SOCKET PGA 279POS GOLD Preci-Dip |
3,377 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-357M19-001148CONN SOCKET BGA 357POS GOLD Preci-Dip |
2,883 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 357 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
2,252 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-321-19-121144CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,824 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 321 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-356M26-001152BGA SOLDER TAIL Preci-Dip |
3,362 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
614-83-281-19-001112CONN SOCKET PGA 281POS GOLD Preci-Dip |
2,582 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 281 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-463-19-101147CONN SOCKET PGA 463POS GOLD Preci-Dip |
2,009 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 463 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-432M31-001148CONN SOCKET BGA 432POS GOLD Preci-Dip |
2,452 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 432 (31 x 31) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-299-20-001112CONN SOCKET PGA 299POS GOLD Preci-Dip |
2,080 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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