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| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-576M30-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,387 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 576 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-356M26-001105CONN SOCKET PGA 356POS GOLD Preci-Dip |
3,923 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
518-77-357M19-001105CONN SOCKET PGA 357POS GOLD Preci-Dip |
3,153 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-360M19-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,135 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | BGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-352M26-001106CONN SOCKET PGA 352POS GOLD Preci-Dip |
3,947 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
518-77-360M19-001105CONN SOCKET PGA 360POS GOLD Preci-Dip |
3,682 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
518-77-356M26-001106CONN SOCKET PGA 356POS GOLD Preci-Dip |
2,191 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
518-77-357M19-001106CONN SOCKET PGA 357POS GOLD Preci-Dip |
3,275 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-388M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,296 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | PGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-520M31-001148CONN SOCKET BGA 520POS GOLD Preci-Dip |
2,284 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 520 (31 x 31) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-360M19-001106CONN SOCKET PGA 360POS GOLD Preci-Dip |
2,788 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
546-83-447-20-121147CONN SOCKET PGA 447POS GOLD Preci-Dip |
2,100 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 447 (20 x 20) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-420M26-001148CONN SOCKET BGA 420POS GOLD Preci-Dip |
2,120 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 420 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-420M26-001152BGA SOLDER TAIL Preci-Dip |
2,749 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
614-83-325-18-111144CONN SOCKET PGA 325POS GOLD Preci-Dip |
2,673 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 325 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-400M20-000101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,214 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | PGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-432M31-001148CONN SOCKET BGA 432POS GOLD Preci-Dip |
2,449 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 432 (31 x 31) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
3,729 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-600M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,299 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 600 (35 x 35) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
614-83-321-19-121144CONN SOCKET PGA 321POS GOLD Preci-Dip |
3,306 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 321 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
- 1500+ 일일 평균 RFQ
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