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| 사진: | 제조업체 부품 번호 | 재고 상태 | 가격 | 수량 | 데이터시트 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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514-87-478M26-131148CONN SOCKET BGA 478POS GOLD Preci-Dip |
3,663 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 478 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-480M29-001148CONN SOCKET BGA 480POS GOLD Preci-Dip |
2,504 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 480 (29 x 29) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-360M19-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,777 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | PGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-388M26-001148CONN SOCKET BGA 388POS GOLD Preci-Dip |
3,399 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 388 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-528-21-121147CONN SOCKET PGA 528POS GOLD Preci-Dip |
3,755 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 528 (21 x 21) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-388M26-001152BGA SOLDER TAIL Preci-Dip |
3,935 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-87-529-21-121147CONN SOCKET PGA 529POS GOLD Preci-Dip |
3,955 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 529 (21 x 21) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-545-17-000147CONN SOCKET PGA 545POS GOLD Preci-Dip |
3,070 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 545 (17 x 17) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-419-19-111147CONN SOCKET PGA 419POS GOLD Preci-Dip |
3,482 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 419 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-560M33-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,201 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-420-19-111147CONN SOCKET PGA 420POS GOLD Preci-Dip |
3,284 | - |
RFQ |
데이터시트 |
Bulk | 546 | Active | PGA | 420 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-352M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,704 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | BGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-500M30-001148CONN SOCKET BGA 500POS GOLD Preci-Dip |
2,116 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 500 (30 x 30) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-400M20-000148CONN SOCKET BGA 400POS GOLD Preci-Dip |
3,468 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 400 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-296-19-131144CONN SOCKET PGA 296POS GOLD Preci-Dip |
2,993 | - |
RFQ |
데이터시트 |
Bulk | 614 | Active | PGA | 296 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-352M26-001105CONN SOCKET PGA 352POS GOLD Preci-Dip |
2,560 | - |
RFQ |
데이터시트 |
Bulk | 518 | Active | PGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-87-504M29-001148CONN SOCKET BGA 504POS GOLD Preci-Dip |
2,887 | - |
RFQ |
데이터시트 |
Bulk | 514 | Active | BGA | 504 (29 x 29) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-356M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,331 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-400M20-000152BGA SOLDER TAIL Preci-Dip |
2,991 | - |
RFQ |
데이터시트 |
Bulk | 550 | Active | BGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-357M19-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,005 | - |
RFQ |
데이터시트 |
Bulk | 558 | Active | BGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
- 1500+ 일일 평균 RFQ
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